pga pin grid array package

pGA chip packaging is commonly used in the packaging of microprocessors. Generally, the integrated circuit (IC) is packaged in a ceramic chip. The bottom of the ceramic chip is arranged into square pins. These pins can be inserted or soldered to the circuit board The corresponding socket is very suitable for applications that require frequent wave insertion. For chips with the same pin, the pGA package usually requires a smaller area than the conventional dual in-line package.
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The pGA package has the characteristics of more convenient plug-in operation, high reliability and adaptability to higher frequencies. The early pentium chips, 80486, pentium, and pentiumpro in the InTel series CpU all adopt this package form.
BGA ball grid array package
The BGA package is improved from the pGA pin grid array. It is a packaging method that covers a surface with a grid pattern to cover the pins. When in operation, it can conduct electronic signals from the integrated circuit to the The printed circuit board where it is located. Under the BGA package, the pins are replaced by solder balls at the bottom of the package. These solder balls can be configured manually or through an automated machine, and they are positioned through flux.
BGA packages can provide more pins than other packages such as dual in-line packages or four-side flat packages. The ground surface of the entire device can be used as pins, which can be shorter than the surrounding package types The average wire length is to have more high-speed performance.
DIp dual in-line package
The so-called DIp dual in-line package refers to an integrated circuit chip that is packaged in a dual in-line form. Most small and medium-sized integrated circuit ICs use this package form, and the number of pins generally does not exceed 100. The CpU chip with DIp package has two rows of pins, which need to be inserted into the chip socket with DIp structure. DIp-packaged chips should be especially careful when plugging and unplugging from the chip socket to avoid damage to the pins.


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Components commonly used in EMC peripheral circuits

As a protection device, TVS is faster than varistor and gas discharge tube, and has poor surge resistance. It is a clamping device and the clamping voltage is more stable. Often used as an electrostatic protection device, it can also be used in combination with a varistor and a gas discharge tube as a stepped protection to release surge energy.
What are the commonly used components of EMC peripheral circuits, and what precautions need to be paid for selection
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X capacitance
The X capacitor acts as a safety capacitor and is connected between the L and N lines to filter out the differential mode interference of the power supply. Its volume is large, but the ripple current is allowed to be high and the withstand voltage is high. X1, X2 or X3 capacitors can be selected according to different applications. For example, the commonly used X2 capacitor can be used in the place where the transient voltage of the power grid is ≤2.5KV.
Y capacitance
The Y capacitor is usually connected across the primary circuit and the secondary circuit or between the primary circuit and the protective ground to filter out common mode noise. Its capacity is usually small to meet leakage current requirements.
Y capacitors can be divided into Y1, Y2, Y3, and Y4 grades. For different grades, they can withstand different pulse voltages and require sufficient margin in electrical and mechanical properties to avoid breakdown short-circuits and jeopardize personal safety.
Differential mode inductance
Usually used to filter out low frequency interference. During the differential mode surge test, a part of the energy is stored and then released. It will also have the same effect in the static test at the output end. If the differential mode inductor is placed behind the rectifier bridge, be careful of the high voltage generated when its energy is released to damage the rectifier bridge.


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雙背設計的兒童學習椅更好

為兒童設計的雙背椅學習強調下背部翅膀的支持,只有當緊靠後面的孩子,兩回僅從向內的力,雙方提供的支持,讓孩子保持正確的姿勢,同時給予脊椎大力支持。但是,我們知道久坐學習的過程中,孩子,不保持一個坐姿,有必要適當地調整脊椎和姿勢,讓身體放松,以及孩子在學校寫作業時,你的背部是很難依靠緊緊在後面,支撐被破壞,所以雙背設計的缺陷是過於理想化顯得有點雞肋。更重要的是,當孩子不適合背雙備份,雙回活動甚至有可能在背部和脊柱後部的乘坐兒童“重”。
| b a b y | 陪伴也是一種愛 – 快樂童年 inspired by 「迪士尼美語 世界
兒童單後座學習強調對兒童脊柱中線位置背部支撐,同時考慮到全面支持整個背部的一段時間。座椅靠背可以通過高度和不同的高度前,孩子的背部曲線後進行調整,不管孩子的姿勢調整,調整後的曲線回將讓孩子回歸到最舒適的狀態。
迪士尼美語 好唔好?提高小朋友的學習興趣,達到學得愉快,玩得開心。
呵護自己孩子心理健康,就給孩子進行選擇好的兒童學生學習椅。綜合分析對比考量,單背設計的兒童通過學習椅注重對孩子脊椎的支撐呵護,同時也能為社會科學的坐姿習慣發展提供一個引導,在人體工學性上的優勢企業更為明顯。西昊致力於打造人體工學單背兒童教育學習椅,為孩子的快樂生活學習和健康快速成長保駕護航。
迪士尼美語 好唔好還有另外一個現象可以說明,很多家長可能都發現了自從孩子們通過迪士尼美語學習了之後會變得非常的開朗、樂觀而且積極。


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